SLVSG43A December   2023  – November 2024 TPSI3100-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristic Curves
    12. 6.12 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Transmission of the Enable State
      2. 8.3.2 Power Transmission
      3. 8.3.3 Gate Driver
      4. 8.3.4 Chip Enable (CE)
      5. 8.3.5 Comparators
        1. 8.3.5.1 Fault Comparator
        2. 8.3.5.2 Alarm Comparator
        3. 8.3.5.3 Comparator De-glitch
      6. 8.3.6 VDDP, VDDH, and VDDM Undervoltage Lockout (UVLO)
      7. 8.3.7 Keep-Off Circuitry
      8. 8.3.8 Thermal Shutdown
    4. 8.4 Device Operation
    5. 8.5 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 CDIV1, CDIV2 Capacitance
        2. 9.2.2.2 Start-up Time and Recovery Time
        3. 9.2.2.3 RSHUNT, R1, and R2 Selection
        4. 9.2.2.4 Overcurrent Fault Error
        5. 9.2.2.5 Overcurrent Alarm Error
        6. 9.2.2.6 VDDP Capacitance, CVDDP
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DVX|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Keep-Off Circuitry

The TPSI310x-Q1, TPSI311x-Q1, TPSI312x-Q1, and TPSI3133-Q1 family contains keep-off circuitry on the output driver. The purpose of the keep-off circuitry is to clamp the gate voltage below an acceptable level to prevent the external power switch from turning on when no power is present on the secondary rails. The keep-off circuitry can be used to replace or greatly reduce the requirements of an external bleed-off resistor on the external power switch.

Figure 8-9 shows a simplified schematic of the keep-off circuitry. Transistors MP1 and MN1 form the driver that provides the gate current to drive the external power switch (M1). When no power is available on the secondary, the 1MΩ resistor, is connected from the drain to gate of MN1, forming an NMOS diode configuration. Any external coupling into the VDRV signal, via the M1 parasitic gate-to-drain and gate-to-source capacitances, can cause the VDRV signal to rise. The diode configuration of MN1 sinks this current to keep VDRV from rising too high, clamping VDRV to VACT_CLAMP . This is sufficient to keep most power switches off. If desired, an additional resistance can also be placed (on the order of 250kΩ or higher) across the gate-to-source of M1. Note that any resistance applied requires power from the secondary supply in normal operation and must be accounted for in the overall power budget.

In addition to the MN1 diode clamp, the body diode of MP1 can also help absorb any coupling into VDRV. The equivalent capacitance, Ceq, which is the series combination of CDIV1 and CDIV2 is typically on the order of hundreds of nanofarads for most applications. If power transfer has ceased for some time, this capacitance is fully discharged to VSSS and clamps VDRV a diode above VSSS via the body diode of MP1 connected to VDDH. Any external coupling into the VDRV signal, via the M1 parasitic gate-to-drain and gate-to-source capacitances, is absorbed by Ceq, minimizing the voltage rise on VDRV.

TPSI3100-Q1 Keep-Off Circuitry Figure 8-9 Keep-Off Circuitry