SLVSHN4 December   2023 TPSI3100

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristic Curves
    12. 6.12 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Transmission of the Enable State
      2. 8.3.2 Power Transmission
      3. 8.3.3 Gate Driver
      4. 8.3.4 Chip Enable (CE)
      5. 8.3.5 Comparators
        1. 8.3.5.1 Fault Comparator
        2. 8.3.5.2 Alarm Comparator
        3. 8.3.5.3 Comparator De-glitch
      6. 8.3.6 VDDP, VDDH, and VDDM Under-voltage Lockout (UVLO)
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Operation
    5. 8.5 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 CDIV1, CDIV2 Capacitance
        2. 9.2.2.2 Start-up Time and Recovery Time
        3. 9.2.2.3 RSHUNT, R1, and R2 Selection
        4. 9.2.2.4 Over-current Fault Error
        5. 9.2.2.5 Over-current Alarm Error
        6. 9.2.2.6 VDDP Capacitance, CVDDP
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DVX|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.2 Layout Example

Figure 9-3 shows a PCB layout example with the signals and key components labeled.

GUID-20231103-SS0I-RX8C-3RRH-ZRBXZH1X73Q5-low.png Figure 9-3 3-D PCB View
GUID-20231103-SS0I-HNT8-W7KG-S4HCR8JZMTNP-low.png Figure 9-4 Top Layer
GUID-20231103-SS0I-LG9H-KJNX-HF0FMTTTQNBQ-low.png Figure 9-5 Bottom Layer
GUID-20231103-SS0I-5QFL-195S-X0CVGDKR5JVX-low.png Figure 9-6 Signal Layer 1
GUID-20231103-SS0I-RRXQ-LTKX-C4TP8H5C9X5Z-low.png Figure 9-7 Signal Layer 2