SNVSCI1A October   2023  – December 2023 TPSM365R1 , TPSM365R15

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Enable, Shutdown, and Start-Up
      2. 7.3.2  External CLK SYNC (With MODE/SYNC)
        1. 7.3.2.1 Pulse Dependent MODE/SYNC Pin Control
      3. 7.3.3  Adjustable Switching Frequency (with RT)
      4. 7.3.4  Power-Good Output Operation
      5. 7.3.5  Internal LDO, VCC UVLO, and VOUT/FB Input
      6. 7.3.6  Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      7. 7.3.7  Output Voltage Selection
      8. 7.3.8  Spread Spectrum
      9. 7.3.9  Soft Start and Recovery from Dropout
        1. 7.3.9.1 Soft Start
        2. 7.3.9.2 Recovery from Dropout
      10. 7.3.10 Current Limit and Short Circuit
      11. 7.3.11 Thermal Shutdown
      12. 7.3.12 Input Supply Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 CCM Mode
        2. 7.4.3.2 AUTO Mode - Light Load Operation
          1. 7.4.3.2.1 Diode Emulation
          2. 7.4.3.2.2 Frequency Reduction
        3. 7.4.3.3 FPWM Mode - Light Load Operation
        4. 7.4.3.4 Minimum On-time Operation
        5. 7.4.3.5 Dropout
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Choosing the Switching Frequency
        3. 8.2.2.3  Setting the Output Voltage
        4. 8.2.2.4  Input Capacitor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  VCC
        7. 8.2.2.7  CFF Selection
        8. 8.2.2.8  External UVLO
        9. 8.2.2.9  Power-Good Signal
        10. 8.2.2.10 Maximum Ambient Temperature
        11. 8.2.2.11 Other Connections
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Typical Characteristics

Unless otherwise specified, the following conditions apply: TA = 25°C, VIN = 13.5 V.

GUID-20231001-SS0I-0QWZ-WQLG-N8DM6W6QP7MN-low.svgFigure 6-1 Shutdown Supply Current vs Ambient Temperature
GUID-20231001-SS0I-4MRS-1GRW-PP9GLN3RPNRC-low.svgFigure 6-3 HSFET and LSFET RDSON vs Temperature
GUID-20231001-SS0I-HLCV-CPV4-SF67PQVVTD4P-low.svgFigure 6-5 Minimum On-Time vs Temperature
GUID-20231001-SS0I-JTLF-LC5H-GZXW3PD8JNQS-low.svgFigure 6-2 3.3-V Feedback Voltage vs Temperature
GUID-20231001-SS0I-FPLV-8LZ4-1GVB8PDWWQ52-low.svgFigure 6-4 Precision Enable High Threshold vs Temperature
GUID-20231001-SS0I-TRV8-DSNH-X79NQBMMCLGR-low.svgFigure 6-6 High-Side (Peak) and Low-Side Valley Current Limits