SLVSEW0A September   2020  – December 2020 TPSM41625

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (PVIN = 12 V)
    7. 6.7 Typical Characteristics (PVIN = 5 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Setting the Output Voltage
      2. 7.3.2  Output Voltage Current Rating
      3. 7.3.3  RS+/RS- Remote Sense Function
      4. 7.3.4  Ramp Select (RAMP and RAMP_SEL)
      5. 7.3.5  Switching Frequency (RT)
      6. 7.3.6  Synchronization (SYNC)
        1. 7.3.6.1 Loss of Synchronization
      7. 7.3.7  Stand-alone/Stackable Operation
        1. 7.3.7.1 Stackable Synchronization
          1. 7.3.7.1.1 Sync Configuration
          2. 7.3.7.1.2 Clock Sync Point Selection
          3. 7.3.7.1.3 Configuration 1: Dual Phase, Primary Sync-Out Clock to Secondary
          4. 7.3.7.1.4 Configuration 2: Dual Phase, Primary and Secondary Sync to External System Clock
      8. 7.3.8  Improved Transient Performance versus Fixed Frequency (Stand-alone Operation Only)
      9. 7.3.9  Output On/Off Enable (EN)
      10. 7.3.10 Power Good (PGOOD)
      11. 7.3.11 Soft-Start Operation
      12. 7.3.12 Input Capacitor Selection
      13. 7.3.13 Output Capacitor Selection
      14. 7.3.14 Current Limit (ILIM)
      15. 7.3.15 Safe Start-up into Pre-Biased Outputs
      16. 7.3.16 Overcurrent Protection
      17. 7.3.17 Output Overvoltage and Undervoltage Protection
      18. 7.3.18 Overtemperature Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Setting the Switching Frequency
        4. 8.2.2.4 RAMP Setting
        5. 8.2.2.5 Input Capacitors
        6. 8.2.2.6 Output Capacitors
      3. 8.2.3 Application Waveforms
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Package Specifications
      2. 10.2.2 EMI
        1. 10.2.2.1 EMI Plots
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage PVIN –0.3 17 V
PVIN to SW DC –0.3 25 V
<10 ns –5 25 V
VIN –0.3 18 V
VSEL, SS, MODE, RT, SYNC, EN, ISHARE, ILIM –0.3 7 V
RS+ –0.3 3.6 V
RS- –0.3 0.3 V
AGND, PGND –0.3 0.3 V
SW DC –0.3 20 V
<10 ns –5.0 20 V
Output voltage VOUT –0.3 8 V
BP5, PGOOD, RAMP –0.3 7 V
VSHARE –0.3 3.6 V
Mechanical shock Mil-STD-883H, Method 2002.5, 1 msec, 1/2 sine, mounted 500 G
Mechanical vibration Mil-STD-883H, Method 2007.3, 20 to 2000 Hz 20 G
Operating IC junction temperature, TJ  (2) –40 125 °C
Operating ambient temperature, TA  (2) –40 105 °C
Storage temperature, Tstg –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.