SLVSGJ5 April   2022 TPSM63604

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Typical Characteristics
    8. 7.8 Typical Characteristics (VIN = 12 V)
    9. 7.9 Typical Characteristics (VIN = 24 V)
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input Voltage Range (VIN1, VIN2)
      2. 8.3.2  Adjustable Output Voltage (FB)
      3. 8.3.3  Input Capacitors
      4. 8.3.4  Output Capacitors
      5. 8.3.5  Switching Frequency (RT)
      6. 8.3.6  Precision Enable and Input Voltage UVLO (EN/SYNC)
      7. 8.3.7  Frequency Synchronization (EN/SYNC)
      8. 8.3.8  Power Good Monitor (PG)
      9. 8.3.9  Adjustable Switch-Node Slew Rate (RBOOT, CBOOT)
      10. 8.3.10 Bias Supply Regulator (VCC, VLDOIN)
      11. 8.3.11 Overcurrent Protection (OCP)
      12. 8.3.12 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design 1 – High-Efficiency 4-A Synchronous Buck Regulator for Industrial Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 9.2.1.2.2 Output Voltage Setpoint
          3. 9.2.1.2.3 Switching Frequency Selection
          4. 9.2.1.2.4 Input Capacitor Selection
          5. 9.2.1.2.5 Output Capacitor Selection
          6. 9.2.1.2.6 Other Connections
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2 – Inverting Buck-Boost Regulator with Negative Output Voltage
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Output Voltage Setpoint
          2. 9.2.2.2.2 IBB Maximum Output Current
          3. 9.2.2.2.3 Switching Frequency Selection
          4. 9.2.2.2.4 Input Capacitor Selection
          5. 9.2.2.2.5 Output Capacitor Selection
          6. 9.2.2.2.6 Other Considerations
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Design and Layout
    2. 11.2 Layout Example
      1. 11.2.1 Package Specifications
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Overview

The TPSM63604 is an easy-to-use, synchronous buck DC/DC power module designed for a wide variety of applications where reliability, small solution size, and low EMI signature are of paramount importance. With integrated power MOSFETs, a buck inductor, and PWM controller, the TPSM63604 operates over an input voltage range of 3 V to 36 V with transients as high as 42 V. The module delivers up to 6-A DC load current with high conversion efficiency and ultra-low input quiescent current in a very small solution footprint. Control loop compensation is not required, reducing design time and external component count.

With a programmable switching frequency from 200 kHz to 2.2 MHz using its RT pin or an external clock signal, the TPSM63604 incorporates specific features to improve EMI performance in noise-sensitive applications:

  • An optimized package and pinout design enables a shielded switch-node layout that mitigates radiated EMI.
  • Parallel input and output paths with symmetrical capacitor layouts minimize parasitic inductance, switch-voltage ringing, and radiated field coupling
  • Resistor-programmable switch-node slew rate
  • Clock synchronization and FPWM mode enable constant switching frequency across the load current range.
  • Integrated power MOSFETs with enhanced gate drive control enable low-noise PWM switching.

Together, these features significantly reduce EMI filtering requirements, while helping to meet CISPR 11 and CISPR 32 Class B EMI limits for conducted and radiated emissions.

The TPSM63604 module also includes inherent protection features for robust system requirements:

  • An open-drain PGOOD indicator for power-rail sequencing and fault reporting
  • Precision enable input with hysteresis, providing:
    • Programmable line undervoltage lockout (UVLO)
    • Remote ON/OFF capability
  • Internally fixed output-voltage soft start with monotonic start-up into prebiased loads
  • Hiccup-mode overcurrent protection with cycle-by-cycle peak and valley current limits
  • Thermal shutdown with automatic recovery.

Leveraging a pin arrangement designed for simple layout that requires only a few external components, the TPSM63604 is specified to maximum ambient and junction temperatures of 105°C and 125°C, respectively.