SLVSGB4B
October 2021 – April 2022
TPSM63606
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
System Characteristics
7.7
Typical Characteristics
7.8
Typical Characteristics (VIN = 12 V)
7.9
Typical Characteristics (VIN = 24 V)
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Input Voltage Range (VIN1, VIN2)
8.3.2
Adjustable Output Voltage (FB)
8.3.3
Input Capacitors
8.3.4
Output Capacitors
8.3.5
Switching Frequency (RT)
8.3.6
Precision Enable and Input Voltage UVLO (EN/SYNC)
8.3.7
Frequency Synchronization (EN/SYNC)
8.3.8
Spread Spectrum
8.3.9
Power Good Monitor (PG)
8.3.10
Adjustable Switch-Node Slew Rate (RBOOT, CBOOT)
8.3.11
Bias Supply Regulator (VCC, VLDOIN)
8.3.12
Overcurrent Protection (OCP)
8.3.13
Thermal Shutdown
8.4
Device Functional Modes
8.4.1
Shutdown Mode
8.4.2
Standby Mode
8.4.3
Active Mode
9
Applications and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Design 1 – High-Efficiency 6-A Synchronous Buck Regulator for Industrial Applications
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.2.1
Custom Design With WEBENCH® Tools
9.2.1.2.2
Output Voltage Setpoint
9.2.1.2.3
Switching Frequency Selection
9.2.1.2.4
Input Capacitor Selection
9.2.1.2.5
Output Capacitor Selection
9.2.1.2.6
Other Connections
9.2.1.3
Application Curves
9.2.2
Design 2 – Inverting Buck-Boost Regulator with Negative Output Voltage
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.2.1
Output Voltage Setpoint
9.2.2.2.2
IBB Maximum Output Current
9.2.2.2.3
Switching Frequency Selection
9.2.2.2.4
Input Capacitor Selection
9.2.2.2.5
Output Capacitor Selection
9.2.2.2.6
Other Considerations
9.2.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.1.1
Thermal Design and Layout
11.2
Layout Example
11.2.1
Package Specifications
12
Device and Documentation Support
12.1
Device Support
12.1.1
Third-Party Products Disclaimer
12.1.2
Development Support
12.1.2.1
Custom Design With WEBENCH® Tools
12.2
Documentation Support
12.2.1
Related Documentation
12.3
Receiving Notification of Documentation Updates
12.4
Support Resources
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RDL|20
MPQF630A
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvsgb4b_oa
slvsgb4b_pm
11.2
Layout Example
Figure 11-1
Typical Layout
Figure 11-2
Typical Top Layer Design