SLVSGU1A November   2022  – December 2023 TPSM63610

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range (VIN1, VIN2)
      2. 7.3.2  Adjustable Output Voltage (FB)
      3. 7.3.3  Input Capacitors
      4. 7.3.4  Output Capacitors
      5. 7.3.5  Switching Frequency (RT)
      6. 7.3.6  Precision Enable and Input Voltage UVLO (EN)
      7. 7.3.7  Frequency Synchronization (SYNC/MODE)
      8. 7.3.8  Spread Spectrum
      9. 7.3.9  Power-Good Monitor (PG)
      10. 7.3.10 Adjustable Switch-Node Slew Rate (RBOOT, CBOOT)
      11. 7.3.11 Bias Supply Regulator (VCC, VLDOIN)
      12. 7.3.12 Overcurrent Protection (OCP)
      13. 7.3.13 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1 – High-Efficiency 8-A (10-A peak) Synchronous Buck Regulator for Industrial Applications
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Output Voltage Setpoint
          3. 8.2.1.2.3 Switching Frequency Selection
          4. 8.2.1.2.4 Input Capacitor Selection
          5. 8.2.1.2.5 Output Capacitor Selection
          6. 8.2.1.2.6 Other Connections
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Design 2 – Inverting Buck-Boost Regulator with Negative Output Voltage
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Output Voltage Setpoint
          2. 8.2.2.2.2 IBB Maximum Output Current
          3. 8.2.2.2.3 Switching Frequency Selection
          4. 8.2.2.2.4 Input Capacitor Selection
          5. 8.2.2.2.5 Output Capacitor Selection
          6. 8.2.2.2.6 Other Considerations
        3. 8.2.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Design and Layout
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC (1) TPSM636XX UNIT
RDF
22 PINS
RθJA Junction-to-ambient thermal resistance (TPSM63610EVM) (3) 18 °C/W
RθJA Junction-to-ambient thermal resistance (JESD 51-7) (2) 25 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 12.8 °C/W
RθJB Junction-to-board thermal resistance 7.4 °C/W
ΨJT Junction-to-top characterization parameter 0.7 °C/W
ΨJB Junction-to-board characterization parameter 7.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.  
(2) The value of RΘJA given in this table is only valid for comparison with other packages and can not be used for design purposes. These values were calculated in accordance with JESD 51-7, and simulated on a 4-layer JEDEC board. They do not represent the performance obtained in an actual application.  For example, the EVM RΘJA = 21.6  °C/W.  For design information please see the thermal design and layout section.
(3) Refer to the EVM User's Guide for board layout and additional information.  For thermal design information please see the thermal design and layout section.