SLVSHL0B June 2024 – July 2024 TPSM81033
ADVANCE INFORMATION
Restrict the maximum IC junction temperature to 125°C under normal operating conditions. Calculate the maximum allowable dissipation, PD(max), and keep the actual power dissipation less than or equal to PD(max). The maximum-power-dissipation limit is determined using Equation 5.
where
The TPSM81033 comes in a QFN package. The real junction-to-ambient thermal resistance of the package greatly depends on the PCB type, layout. Using larger and thicker PCB copper for the power pads (GND, PVIN, and VOUT) to enhance the thermal performance. Using more vias connects the ground plate on the top layer and bottom layer around the IC without solder mask also improves the thermal capability.