SLVSHL0C June   2024  – September 2024 TPSM81033

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout
      2. 6.3.2 Enable and Soft Start
      3. 6.3.3 Setting the Output Voltage
      4. 6.3.4 Pass-Through Operation
      5. 6.3.5 Power Good Indicator
      6. 6.3.6 Implement Output Discharge by PG function
      7. 6.3.7 Overvoltage Protection
      8. 6.3.8 Output Short-to-Ground Protection
      9. 6.3.9 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 PWM Mode
      2. 6.4.2 Power-Save Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Setting the Output Voltage
        2. 7.2.2.2 Output Capacitor Selection
        3. 7.2.2.3 Input Capacitor Selection
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
      3. 7.4.3 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
  • VCD|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) TPSM81033 TPSM81033 UNIT
VCD (QFN)- 9 PINS VCD (QFN)- 9 PINS
Standard EVM (2)
RθJA Junction-to-ambient thermal resistance 74.8 39.7 °C/W
RθJC Junction-to-case thermal resistance 36.6 NA °C/W
RθJB Junction-to-board thermal resistance 21.7 NA °C/W
ΨJT Junction-to-top characterization parameter 0.7 TBD °C/W
ΨJB Junction-to-board characterization parameter 21.1 19.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Measured on TPSM81033EVM, 4-layer, 2oz copper NA PCB.