SLVSDT1C July   2017  – June 2020 TPSM82480

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application space
      2.      Efficiency vs Output Current space space
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Enable and Shutdown (EN)
      2. 7.3.2  Soft-Start (SS), Pre-biased Output
      3. 7.3.3  Tracking (TR)
      4. 7.3.4  Output Voltage Select (VSEL)
      5. 7.3.5  Forced PWM (MODE)
      6. 7.3.6  Power Good (PG)
      7. 7.3.7  Thermal Good (TG)
      8. 7.3.8  Active Output Discharge
      9. 7.3.9  Undervoltage Lockout (UVLO)
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Width Modulation (PWM) Operation
      2. 7.4.2 Power Save Mode (PSM) Operation
      3. 7.4.3 Minimum Duty Cycle and 100% Mode Operation
      4. 7.4.4 Phase Shifted Operation
      5. 7.4.5 Phase Add/Shed and Current Balancing
      6. 7.4.6 Current Limit and Short Circuit Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Setting VOUT2 Using the VSEL Feature
        3. 8.2.2.3 Feedforward Capacitance
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 Soft-Start Capacitor Selection
        7. 8.2.2.7 Tracking
        8. 8.2.2.8 Thermal Good
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.10 Thermal Shutdown

The junction temperature (TJ) of the device is monitored by an internal temperature sensor. If TJ exceeds 160°C (typical), the device goes in thermal shutdown with a hysteresis of approxiimately 10°C. Both the power FETs are turned off and the PG pin goes Low. Once TJ has decreased enough, the device resumes normal operation with the soft-start sequence.