SLUSEY7B December   2022  – December 2024 TPSM82816

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Precise Enable (EN)
      2. 7.3.2 Output Discharge
      3. 7.3.3 COMP/FSET
      4. 7.3.4 MODE/SYNC
      5. 7.3.5 Spread Spectrum Clocking (SSC)
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 Power-Good Output (PG)
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Width Modulation (PWM) Operation
      2. 7.4.2 Power Save Mode Operation (PSM)
      3. 7.4.3 100% Duty-Cycle Operation
      4. 7.4.4 Current Limit and Short-Circuit Protection
      5. 7.4.5 Soft Start / Tracking (SS/TR)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Feedforward Capacitor
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Voltage Tracking
      2. 8.3.2 Synchronizing to an External Clock
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
        1. 8.5.2.1 Thermal Consideration
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • VCA|13
  • SIE|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5 Trademarks

MicroSIP, and MagPack, and TI E2E™ are trademarks of Texas Instruments.

All trademarks are the property of their respective owners.