SLUSF35 November   2023 TPSM828510 , TPSM828511 , TPSM828512

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Schematic
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Precise Enable (EN)
      2. 8.3.2 MODE/SYNC
      3. 8.3.3 Undervoltage Lockout (UVLO)
      4. 8.3.4 Power-Good Output (PG)
      5. 8.3.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation (PFM/PWM)
      3. 8.4.3 100% Duty-Cycle Operation
      4. 8.4.4 Current Limit and Short-Circuit Protection
      5. 8.4.5 Output Discharge
      6. 8.4.6 Soft Start / Tracking (SS/TR)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming the Output Voltage
        2. 9.2.2.2 Feedforward Capacitor
        3. 9.2.2.3 Input Capacitor
        4. 9.2.2.4 Output Capacitor
        5. 9.2.2.5 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Voltage Tracking
      2. 9.3.2 Synchronizing to an External Clock
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
        1. 9.5.2.1 Thermal Consideration
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5.2.1 Thermal Consideration

The TPSM82851x module temperature must be kept less than the maximum rating of 125°C. The following are three basic approaches for enhancing thermal performance:

  • Improve the power dissipation capability of the PCB design.
  • Improve the thermal coupling of the component to the PCB.
  • Introduce airflow into the system.

To estimate the approximate module temperature of the TPSM82851x, apply the typical efficiency stated in this data sheet to the desired application condition to compute the power dissipation of the module. Then, calculate the module temperature rise by multiplying the power dissipation by the power dissipation thermal resistance. For more details on how to use the thermal parameters in real applications, see the application notes: Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs and Semiconductor and IC Package Thermal Metrics.

The thermal values in Thermal Information used the recommended land pattern, shown at the end of this data sheet, including the 18 vias as shown. The TPSM82851x was simulated on a PCB defined by JEDEC 51-7. The 9 vias on the GND pins were connected to copper on other PCB layers, while the remaining 9 vias were not connected to other layers.