SLUSEF1D September   2021  – November 2024 TPSM82864A , TPSM82866A

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Save Mode
      2. 7.3.2 Forced PWM Mode
      3. 7.3.3 Optimized Transient Performance from PWM to PSM Operation
      4. 7.3.4 Low Dropout Operation (100% Duty Cycle)
      5. 7.3.5 Soft Start
      6. 7.3.6 Switch Current Limit and HICCUP Short-Circuit Protection
      7. 7.3.7 Undervoltage Lockout
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable (EN)
      2. 7.4.2 Output Discharge
      3. 7.4.3 Power Good (PG)
      4. 7.4.4 Output Voltage and Mode Selection (VSET/MODE)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting The Output Voltage
        2. 8.2.2.2 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
        1. 8.4.2.1 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPSM8286xA UNIT
RDM (23 PINS) RDJ (23 PINS) RCF (15 PINS)
JEDEC 51-5 EVM JEDEC 51-5 EVM JEDEC 51-7 EVM
RθJA Junction-to-ambient thermal resistance 43.2 25.9 43.3 25.4 66.4 29.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.5 n/a(2) 34.3 n/a(2) 31.8 n/a(2) °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance 21.1 n/a(2) 22.2 n/a(2) n/a(3) n/a(2) °C/W
RθJB Junction-to-board thermal resistance 14.9 n/a(2) 10.8 n/a(2) 19.5 n/a(2) °C/W
ΨJT Junction-to-top characterization parameter 6.8 3.7 3.6 2.4 (-2.2)(4) (-4.2)(4) °C/W
ΨJB Junction-to-board characterization parameter 14.8 12.7 10.7 10.9 18.8 15.5 °C/W
(1) For more information about thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Not applicable to an EVM.
(3) Only applicable for packages with exposed thermal pad.
(4) The junction temperature is lower than the inductor temperature leading to a temperature increase towards the top of the package