SLUSFL6A
June 2024 – November 2024
TPSM82866C
PRODMIX
1
1
Features
2
Applications
3
Description
4
Device Options
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
I2C Interface Timing Characteristics
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Power Save Mode
7.3.2
Forced PWM Mode
7.3.3
Optimized Transient Performance from PWM to PSM Operation
7.3.4
Low Dropout Operation (100% Duty Cycle)
7.3.5
Enable and Soft-Start Ramp
7.3.6
Switch Current Limit and HICCUP Short-Circuit Protection
7.3.7
Undervoltage Lockout
7.3.8
Thermal Warning and Shutdown
7.4
Device Functional Modes
7.4.1
Enable and Disable (EN)
7.4.2
Output Discharge
7.4.3
Start-Up Output Voltage and I2C Target Address Selection (VSET)
7.4.4
Select Output Voltage Registers (VID)
7.5
Programming
7.5.1
Serial Interface Description
7.5.2
Standard-Mode, Fast-Mode, and Fast-Mode Plus Protocol
7.5.3
HS-Mode Protocol
7.5.4
I2C Update Sequence
7.5.5
I2C Register Reset
8
Register Map
8.1
Target Address Byte
8.2
Register Address Byte
8.3
VOUT Register 1
8.4
VOUT Register 2
8.5
CONTROL Register
8.6
STATUS Register
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Input and Output Capacitor Selection
9.2.3
Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.2
Layout Example
9.4.2.1
Thermal Considerations
10
Device and Documentation Support
10.1
Device Support
10.1.1
Third-Party Products Disclaimer
10.2
Documentation Support
10.2.1
Related Documentation
10.3
Receiving Notification of Documentation Updates
10.4
Support Resources
10.5
Trademarks
10.6
Electrostatic Discharge Caution
10.7
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RCF|15
MPQF784
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slusfl6a_oa
slusfl6a_pm
1
Features
Up to 96% efficiency
Excellent thermal performance
I
2
C-compatible interface up to 3.4Mbps
1% output voltage accuracy
DCS-Control topology for fast transient response
I
2
C programmable:
Output voltage
0.4 – 1.675V in 5mV steps
0.8 – 3.35V in 10mV steps
Forced PWM or power save mode
Output voltage discharge
I
2
C device status readback of:
Thermal warning
Hiccup current limit
Vin below UVLO
Resistor selectable:
I
2
C address
16 start-up output voltage options
Optimized for low EMI requirements
No bond wire package
MagPack technology shields inductor and IC
Simplified layout through optimized pinout
4µA operating quiescent current
–40°C to 125°C operating temperature range
2.3mm × 3.0mm × 1.95mm QFN package
28mm
2
design size
Also available without I
2
C interface:
TPSM82866A