SLUSFL6 June   2024 TPSM82866C

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Save Mode
      2. 7.3.2 Forced PWM Mode
      3. 7.3.3 Optimized Transient Performance from PWM to PSM Operation
      4. 7.3.4 Low Dropout Operation (100% Duty Cycle)
      5. 7.3.5 Enable and Soft-Start Ramp
      6. 7.3.6 Switch Current Limit and HICCUP Short-Circuit Protection
      7. 7.3.7 Undervoltage Lockout
      8. 7.3.8 Thermal Warning and Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable (EN)
      2. 7.4.2 Output Discharge
      3. 7.4.3 Start-Up Output Voltage and I2C Target Address Selection (VSET)
      4. 7.4.4 Select Output Voltage Registers (VID)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-Mode, Fast-Mode, and Fast-Mode Plus Protocol
      3. 7.5.3 HS-Mode Protocol
      4. 7.5.4 I2C Update Sequence
      5. 7.5.5 I2C Register Reset
  9. 8 Register Map
    1. 8.1 Target Address Byte
    2. 8.2 Register Address Byte
    3. 8.3 VOUT Register 1
    4. 8.4 VOUT Register 2
    5. 8.5 CONTROL Register
    6. 8.6 STATUS Register
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input and Output Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • RCF|15
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Overview

The TPSM8286xx synchronous, step-down converter power module uses the DCS-Control (Direct Control with seamless transition into power save mode) topology. This topology is an advanced regulation topology that combines the advantages of hysteretic, voltage, and current mode control. The DCS-Control topology operates in PWM (pulse width modulation) mode for medium-to-heavy load conditions and in PSM (power save mode) at light load currents. In PWM, the converter operates with the nominal switching frequency of 2.4MHz, having a controlled frequency variation over the input voltage range. As the load current decreases, the converter enters power save mode, reducing the switching frequency and minimizing the quiescent current of the IC to achieve high efficiency over the entire load current range. DCS-Control supports both operation modes using a single building block and, therefore, has a seamless transition from PWM to PSM without effects on the output voltage. The TPSM8286xx offers excellent DC voltage regulation and load transient regulation, combined with low output voltage ripple, minimizing interference with RF circuits.

The TPSM8286xxxxP versions in the RCF package use MagPack technology to deliver the highest-performance power module design. Leveraging our proprietary integrated-magnetics packaging technology, MagPack (magnetics in package) power modules deliver industry-leading power density, high efficiency, good thermal performance, ease of use, and reduced EMI emissions.