SLUSFL6 June   2024 TPSM82866C

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Save Mode
      2. 7.3.2 Forced PWM Mode
      3. 7.3.3 Optimized Transient Performance from PWM to PSM Operation
      4. 7.3.4 Low Dropout Operation (100% Duty Cycle)
      5. 7.3.5 Enable and Soft-Start Ramp
      6. 7.3.6 Switch Current Limit and HICCUP Short-Circuit Protection
      7. 7.3.7 Undervoltage Lockout
      8. 7.3.8 Thermal Warning and Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable (EN)
      2. 7.4.2 Output Discharge
      3. 7.4.3 Start-Up Output Voltage and I2C Target Address Selection (VSET)
      4. 7.4.4 Select Output Voltage Registers (VID)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-Mode, Fast-Mode, and Fast-Mode Plus Protocol
      3. 7.5.3 HS-Mode Protocol
      4. 7.5.4 I2C Update Sequence
      5. 7.5.5 I2C Register Reset
  9. 8 Register Map
    1. 8.1 Target Address Byte
    2. 8.2 Register Address Byte
    3. 8.3 VOUT Register 1
    4. 8.4 VOUT Register 2
    5. 8.5 CONTROL Register
    6. 8.6 STATUS Register
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input and Output Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • RCF|15
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Voltage(2) VIN, EN, VOS, FB, PG, VSET/VID –0.3 6 V
SW (DC), VOUT –0.3 VIN + 0.3
SW (AC, less than 10ns)(3) –2.5 10
ISINK_SDA_SCL Sink current at SDA, SCL 2 mA
TJ Junction temperature –40 125 °C
Tstg Storage temperature –40 125 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values are with respect to network ground terminal.
(3) While switching.