SLVSGS7D July   2023  – June 2024 TPSM8287A06 , TPSM8287A10 , TPSM8287A12 , TPSM8287A15

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency DCS-Control Topology
      2. 7.3.2  Forced-PWM and Power-Save Modes
      3. 7.3.3  Precise Enable
      4. 7.3.4  Start-Up
      5. 7.3.5  Switching Frequency Selection
      6. 7.3.6  Output Voltage Setting
        1. 7.3.6.1 Output Voltage Setpoint
        2. 7.3.6.2 Output Voltage Range
        3. 7.3.6.3 Non-Default Output Voltage Setpoint
        4. 7.3.6.4 Dynamic Voltage Scaling (DVS)
      7. 7.3.7  Compensation (COMP)
      8. 7.3.8  Mode Selection / Clock Synchronization (MODE/SYNC)
      9. 7.3.9  Spread Spectrum Clocking (SSC)
      10. 7.3.10 Output Discharge
      11. 7.3.11 Undervoltage Lockout (UVLO)
      12. 7.3.12 Overvoltage Lockout (OVLO)
      13. 7.3.13 Overcurrent Protection
        1. 7.3.13.1 Cycle-by-Cycle Current Limiting
        2. 7.3.13.2 Hiccup Mode
        3. 7.3.13.3 Current-Limit Mode
      14. 7.3.14 Power Good (PG)
        1. 7.3.14.1 Power-Good Standalone, Primary Device Behavior
        2. 7.3.14.2 Power-Good Secondary Device Behavior
      15. 7.3.15 Remote Sense
      16. 7.3.16 Thermal Warning and Shutdown
      17. 7.3.17 Stacked Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset (POR)
      2. 7.4.2 Undervoltage Lockout
      3. 7.4.3 Standby
      4. 7.4.4 On
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 7.5.3 I2C Update Sequence
      4. 7.5.4 I2C Register Reset
  9. 8 Device Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting the Input Capacitors
        2. 9.2.2.2 Selecting the Target Loop Bandwidth
        3. 9.2.2.3 Selecting the Compensation Resistor
        4. 9.2.2.4 Selecting the Output Capacitors
        5. 9.2.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.2.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application Using Four TPSM8287Axx in Parallel Operation
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Selecting the Input Capacitors
        2. 9.3.2.2 Selecting the Target Loop Bandwidth
        3. 9.3.2.3 Selecting the Compensation Resistor
        4. 9.3.2.4 Selecting the Output Capacitors
        5. 9.3.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.3.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Input voltage VIN 2.7 6 V
SDA, SCL 0 5
VOUT Output voltage VOUT 0.4 3.35 V or 
(VIN - 1.4 V)(1)		 V
IOUT Output current(3) TPSM8287A06BAS 6 A
TPSM8287A10BAH 10
TPSM8287A12BAS, TPSM8287A12BBS 12
TPSM8287A15BAH,  TPSM8287A15BBH 15
ISINK_PG Sink current at PG pin 10 mA
CIN Input capacitance (per pin)(2) VIN 5 10 µF
COUT Output capacitance(2) TPSM8287A06BAS, TPSM8287A10BAH, 
TPSM8287A12BAS,  TPSM8287A15BAH		 60 (4)
COUT Output capacitance(2) TPSM8287A12BBS, TPSM8287A15BBH 40 (4)
RVSET Resistor value VSET1, VSET2, VSET3 37.6 47 56.4 kΩ
RSYNC_OUT Resistor value SYNC_OUT 37.6 47 56.4 kΩ
CPAR Parasitic capacitance VSET1, VSET2, VSET3 100 pF
SYNC_OUT 20
TJ Operating junction temperature –40 125 °C
(1) Whichever value is lower.
(2) Effective capacitance.
(3) In stacked operation, the maximum output current per phase could be reduced.  See Stacked Operation for details.
(4) The maximum recommended output capacitance depends on the specific operating conditions of an application. Output capacitance values up to a few mF are typically possible, however.