SLVSGS7D July   2023  – June 2024 TPSM8287A06 , TPSM8287A10 , TPSM8287A12 , TPSM8287A15

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency DCS-Control Topology
      2. 7.3.2  Forced-PWM and Power-Save Modes
      3. 7.3.3  Precise Enable
      4. 7.3.4  Start-Up
      5. 7.3.5  Switching Frequency Selection
      6. 7.3.6  Output Voltage Setting
        1. 7.3.6.1 Output Voltage Setpoint
        2. 7.3.6.2 Output Voltage Range
        3. 7.3.6.3 Non-Default Output Voltage Setpoint
        4. 7.3.6.4 Dynamic Voltage Scaling (DVS)
      7. 7.3.7  Compensation (COMP)
      8. 7.3.8  Mode Selection / Clock Synchronization (MODE/SYNC)
      9. 7.3.9  Spread Spectrum Clocking (SSC)
      10. 7.3.10 Output Discharge
      11. 7.3.11 Undervoltage Lockout (UVLO)
      12. 7.3.12 Overvoltage Lockout (OVLO)
      13. 7.3.13 Overcurrent Protection
        1. 7.3.13.1 Cycle-by-Cycle Current Limiting
        2. 7.3.13.2 Hiccup Mode
        3. 7.3.13.3 Current-Limit Mode
      14. 7.3.14 Power Good (PG)
        1. 7.3.14.1 Power-Good Standalone, Primary Device Behavior
        2. 7.3.14.2 Power-Good Secondary Device Behavior
      15. 7.3.15 Remote Sense
      16. 7.3.16 Thermal Warning and Shutdown
      17. 7.3.17 Stacked Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-On Reset (POR)
      2. 7.4.2 Undervoltage Lockout
      3. 7.4.3 Standby
      4. 7.4.4 On
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 7.5.3 I2C Update Sequence
      4. 7.5.4 I2C Register Reset
  9. 8 Device Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting the Input Capacitors
        2. 9.2.2.2 Selecting the Target Loop Bandwidth
        3. 9.2.2.3 Selecting the Compensation Resistor
        4. 9.2.2.4 Selecting the Output Capacitors
        5. 9.2.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.2.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application Using Four TPSM8287Axx in Parallel Operation
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Selecting the Input Capacitors
        2. 9.3.2.2 Selecting the Target Loop Bandwidth
        3. 9.3.2.3 Selecting the Compensation Resistor
        4. 9.3.2.4 Selecting the Output Capacitors
        5. 9.3.2.5 Selecting the Compensation Capacitor, CComp1
        6. 9.3.2.6 Selecting the Compensation Capacitor, CComp2
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage(2) VIN, VSET1, VSET2, VSET3, PG, EN, MODE/SYNC –0.3 6.5 V
SW (DC), VOUT –0.3 VIN + 0.3
SW (AC, less than 10ns)(3) –3 10
COMP –0.3 VIN
VOSNS –0.3 3.8
GOSNS –0.3 0.3
SCL, SDA –0.3 5.5
SYNC_OUT –0.3 2
Current SYNC_OUT, COMP –1 1 mA
SDA 9
EN 0.5
PG 10
TJ Junction temperature –40 125 °C
Tstg Storage temperature –40 125
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltage values are with respect to the GND pin.
(3) While switching.