SLVSH49 October   2024 TPSM82916

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Smart Config (S-CONF)
      2. 6.3.2  Device Enable (EN/SYNC)
      3. 6.3.3  Device Synchronization (EN/SYNC)
      4. 6.3.4  Spread Spectrum Modulation
      5. 6.3.5  Output Discharge
      6. 6.3.6  Undervoltage Lockout (UVLO)
      7. 6.3.7  Power-Good Output
      8. 6.3.8  Noise Reduction and Soft-Start Capacitor (NR/SS)
      9. 6.3.9  Current Limit and Short-Circuit Protection
      10. 6.3.10 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Fixed Frequency Pulse Width Modulation
      2. 6.4.2 Low Duty Cycle Operation
      3. 6.4.3 High Duty Cycle Operation (100% Duty Cycle)
      4. 6.4.4 Second Stage L-C Filter Compensation (Optional)
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 External Component Selection
          1. 7.2.2.2.1 Switching Frequency Selection
          2. 7.2.2.2.2 Output Capacitor Selection
          3. 7.2.2.2.3 Ferrite Bead Selection for Second L-C Filter
          4. 7.2.2.2.4 Input Capacitor Selection
          5. 7.2.2.2.5 Setting the Output Voltage
          6. 7.2.2.2.6 NR/SS Capacitor Selection
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • VCE|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPSM8291x UNIT
VCE 16-pin QFN-FCMOD
JEDEC 51-7 PCB TPSM8291xEVM
RθJA Junction-to-ambient thermal resistance TBD 25.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance TBD n/a (2) °C/W
RθJB Junction-to-board thermal resistance TBD n/a (2) °C/W
ΨJT Junction-to-top characterization parameter TBD TBD °C/W
YJB Junction-to-board characterization parameter TBD TBD °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Not applicable to an EVM.