SLVSDF8B December   2016  – July 2017 TPSM84A22

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Transient Response
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Package Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage (VADJ)
      2. 7.3.2  Input and Output Capacitance
      3. 7.3.3  Transient Response
        1. 7.3.3.1 Transient Response Waveforms
      4. 7.3.4  Oscillator Frequency
      5. 7.3.5  External Clock Syncronization
      6. 7.3.6  Soft Start
      7. 7.3.7  Power Good (PGOOD)
      8. 7.3.8  Gate Driver (VG)
      9. 7.3.9  Startup into Pre-biased Outputs
      10. 7.3.10 Thermal Shutdown
      11. 7.3.11 Overcurrent Protection
      12. 7.3.12 Output Undervoltage/Overvoltage Protection
      13. 7.3.13 Enable (EN)
      14. 7.3.14 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Light Load Operation
      3. 7.4.3 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Input and Output Capacitance
        3. 8.2.2.3 Power Good (PGOOD)
        4. 8.2.2.4 External VG Voltage
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 EMI
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input voltage VIN –0.3 15 V
EN/UVLO –0.3 7 V
PGOOD, SYNC, VG –0.3 6 V
ILIM, VADJ, VS+ –0.3 3 V
PGND –0.3 0.3 V
Output voltage VOUT –0.3 3 V
Source current EN/UVLO 100 µA
Sink current VG 100 mA
PGOOD 4 mA
Mechanical shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 500 G
Mechanical vibration Mil-STD-883D, Method 2007.2, 20-2000Hz 20 G
Operating IC junction temperature, TJ(2) –40 125 °C
Operating ambient temperature, TA (2) –40 85 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves, ensures that the maximum junction temperature of any component inside the module is never exceeded.