SLVSDF8B December   2016  – July 2017 TPSM84A22

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Transient Response
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Package Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage (VADJ)
      2. 7.3.2  Input and Output Capacitance
      3. 7.3.3  Transient Response
        1. 7.3.3.1 Transient Response Waveforms
      4. 7.3.4  Oscillator Frequency
      5. 7.3.5  External Clock Syncronization
      6. 7.3.6  Soft Start
      7. 7.3.7  Power Good (PGOOD)
      8. 7.3.8  Gate Driver (VG)
      9. 7.3.9  Startup into Pre-biased Outputs
      10. 7.3.10 Thermal Shutdown
      11. 7.3.11 Overcurrent Protection
      12. 7.3.12 Output Undervoltage/Overvoltage Protection
      13. 7.3.13 Enable (EN)
      14. 7.3.14 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Light Load Operation
      3. 7.4.3 Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Input and Output Capacitance
        3. 8.2.2.3 Power Good (PGOOD)
        4. 8.2.2.4 External VG Voltage
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 EMI
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.10 Thermal Shutdown

The internal thermal shutdown fault is triggered if the junction temperature exceeds 135°C (typ). This interrupts regulation by making the output high impedance. The device reinitiates the power up sequence when the junction temperature drops below 115°C (typ).