SBOSAA9A March   2023  – June 2024 TRF0208-SEP

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Fully-Differential Amplifier
      2. 6.3.2 Single Supply Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power Down Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving a High-Speed ADC
      2. 7.1.2 Calculating Output Voltage Swing
      3. 7.1.3 Thermal Considerations
    2. 7.2 Typical Applications
      1. 7.2.1 TRF0208-SEP in Receive Chain
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Option Addendum
    2. 10.2 Mechanical Data

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RPV|12
Thermal pad, mechanical data (Package|Pins)

7 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.