SBOS972C october   2021  – august 2023 TRF1208

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: TRF1208
    6. 6.6 Electrical Characteristics: TRF1208B
    7. 6.7 Typical Characteristics: TRF1208
    8. 6.8 Typical Characteristics: TRF1208B
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully-Differential Amplifier
      2. 7.3.2 Single Supply Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Mode
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Driving a High-Speed ADC
      2. 8.1.2 Calculating Output Voltage Swing
      3. 8.1.3 Thermal Considerations
    2. 8.2 Typical Applications
      1. 8.2.1 TRF1208 in Receive Chain
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 TRF1208 in a Transmit Chain
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Considerations

The TRF1208 is available in a 2‑mm × 2‑mm, WQFN-FCRLF package that has excellent thermal properties. Connect the thermal pad underneath the chip to a ground plane. Short the ground plane to the other ground pins of the chip at four corners, if possible, to allow heat propagation to the top layer of PCB. Use a thermal via that connects the thermal pad plane on the top layer of the PCB to the inner layer ground planes to allow heat propagation to the inner layers.

The total power dissipation needs to be limited to keep the device junction temperature below 150°C for instantaneous power and below 125°C for continuous power.