SBOSA17 September   2024 TRF1305B1

ADVMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - TRF1305B1
    6. 6.6 Typical Characteristics - TRF1305B1
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Differential RF Amplifier
      2. 7.3.2 Output Common-Mode Control
      3. 7.3.3 Internal Resistor Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 MODE Pin
        1. 7.4.1.1 Input Common-Mode Extension
      2. 7.4.2 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Interface Considerations
        1. 8.1.1.1 Single-Ended Input
        2. 8.1.1.2 Differential Input
        3. 8.1.1.3 DC Coupling Considerations
      2. 8.1.2 Gain Adjustment With External Resistors in a Differential Input Configuration
    2. 8.2 Typical Application
      1. 8.2.1 TRF1305x1 as ADC Driver in a Zero-IF Receiver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Supply Voltages
      2. 8.3.2 Single-Supply Operation
      3. 8.3.3 Split-Supply Operation
      4. 8.3.4 Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RPV|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 RPV Package, 12-Pin WQFN-FCRLF (Top View)
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NAME NO.
GND 1, 10 Ground Ground. Reference for RF signals and PD control signal. Connect to ground plane on the board. Internally shorted to the thermal pad.
INM 5 Input Negative side of differential input signal
INP 6 Input Positive side of differential input signal
MODE 3 Input Mode selection pin. See also MODE Pin section.
OUTM 11 Output Negative side of differential output signal
OUTP 12 Output Positive side of differential output signal
PD 8 Input Power-down signal, referenced to thermal pad. Supports both 1.8V and 3.3V logic.
Logic 0 or open = device enabled. Logic 1 = device powered down.
VOCM 2 Input Output common-mode voltage input pin. Floating the pin sets the output common-mode voltage to VS– + 2.5V.
VS– 4, 7 Power Negative supply voltage
VS+ 9 Power Positive supply voltage
Thermal Pad Pad Ground Reference for RF signals and PD control signal; also serves as a thermal pad. Connect to heat-dissipating ground or VS– plane on the board.