SLWS223B August   2011  – November 2015 TRF3705

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: General
    6. 6.6  Electrical Characteristics
    7. 6.7  Typical Characteristics: Single-Tone Baseband
    8. 6.8  Typical Characteristics: Two-Tone Baseband
    9. 6.9  Typical Characteristics: Two-Tone Baseband, Mid-Band Calibration
    10. 6.10 Typical Characteristics: No Baseband
    11. 6.11 Typical Characteristics: Two-Tone Baseband
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Gain Control Feature
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Baseband Inputs
        2. 8.2.2.2 LO Input
        3. 8.2.2.3 RF Output
        4. 8.2.2.4 350-MHz Operation
        5. 8.2.2.5 DAC to Modulator Interface Network
        6. 8.2.2.6 DAC348x with TRF3705 Modulator Performance
          1. 8.2.2.6.1 WCDMA
          2. 8.2.2.6.2 LTE
          3. 8.2.2.6.3 MC-GSM
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Definition of Specifications
        1. 11.1.1.1 Carrier Feedthrough
        2. 11.1.1.2 Sideband Suppression
        3. 11.1.1.3 Output Noise
        4. 11.1.1.4 Definition of Terms
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.