SLWS223B August   2011  – November 2015 TRF3705

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: General
    6. 6.6  Electrical Characteristics
    7. 6.7  Typical Characteristics: Single-Tone Baseband
    8. 6.8  Typical Characteristics: Two-Tone Baseband
    9. 6.9  Typical Characteristics: Two-Tone Baseband, Mid-Band Calibration
    10. 6.10 Typical Characteristics: No Baseband
    11. 6.11 Typical Characteristics: Two-Tone Baseband
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Gain Control Feature
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Baseband Inputs
        2. 8.2.2.2 LO Input
        3. 8.2.2.3 RF Output
        4. 8.2.2.4 350-MHz Operation
        5. 8.2.2.5 DAC to Modulator Interface Network
        6. 8.2.2.6 DAC348x with TRF3705 Modulator Performance
          1. 8.2.2.6.1 WCDMA
          2. 8.2.2.6.2 LTE
          3. 8.2.2.6.3 MC-GSM
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Definition of Specifications
        1. 11.1.1.1 Carrier Feedthrough
        2. 11.1.1.2 Sideband Suppression
        3. 11.1.1.3 Output Noise
        4. 11.1.1.4 Definition of Terms
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

The TRF3705 is powered by supplying a nominal 3.3 V to pins 18 and 24. These supplies can be tied together and sourced from a single clean supply. Proper RF bypassing should be placed close to each power supply pin.

Ground pin connections should have at least one ground via close to each ground pin to minimize ground inductance. The PowerPAD™ must be tied to ground, preferably with the recommended ground via pattern to provide a good thermal conduction path to the alternate side of the board and to provide a good RF ground for the device. (Refer to Layout Guidelines for additional information.)