SLOS953B June   2016  – October 2018 TRF4140-Q1

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device and Documentation Support
    1. 3.1 Getting Started and Next Steps
    2. 3.2 Device Nomenclature
    3. 3.3 Documentation Support
    4. 3.4 Community Resources
    5. 3.5 Trademarks
    6. 3.6 Electrostatic Discharge Caution
    7. 3.7 Export Control Notice
    8. 3.8 Glossary
  4. 4Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PHN|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.