TRPGR30ATGC 12-mm Low-Frequency Glass-Encapsulated Transponder, Read Only
1 Device Overview
1.1 Features
- Best-in-Class Performance Through Patented HDX Technology
- Patented Transponder Tuning Provides Stable and High Read Performance
- 80-Bit UID (64-Bit ID, 16-Bit CRC)
- Insensitive to Almost All Nonmetallic Materials
1.2 Applications
- Industrial Automation
- Asset Tracking
1.3 Description
Texas Instruments' 12-mm low-frequency (LF) glass transponders provide superior performance and operate at a resonance frequency of 134.2 kHz. The products are compliant to ISO/IEC 11784 and ISO/IEC 11785 global open standards. Texas Instruments LF glass transponders are manufactured with TI's patented tuning process to provide consistent read performance. Before delivery, the transponders undergo complete functional and parametric testing to provide the high quality customers have come to expect from TI.
Device Information(1)
| PART NUMBER | PACKAGE | BODY SIZE (NOM)(2) |
|---|---|---|
| TRPGR30ATGC | TGC (0) | 2.12 mm x 12.0 mm |
Figure 1-1 shows the transponder.
Figure 1-1 TRPGR30ATGC Transponder
2 Revision History
| DATE | REVISION | NOTES |
|---|---|---|
| August 2014 | * | Initial Release |
3 Specifications
3.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| TA | Operating temperature range | -25 | 85 | °C |
3.2 Handling Ratings
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| TSTG | Storage temperature range | -40 | 85 | °C |
3.3 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)| PARAMETER | TRPGR30ATGC |
|---|---|
| Functionality | Read only |
| Memory (bits) | 80 (64-bit UID + 16-bit CRC) |
| Memory (pages) | 1 |
| Resonance frequency | 134.6 kHz |
| Modulation | FSK (frequency shift keying) 134.2 kHz and 124.2 kHz |
| Transmission principle | HDX (half duplex) |
| Power source | Powered from the reader signal (battery-less) |
| Typical reading range | ≤60 cm(1) |
| Typical reading time | 70 ms |
| Case material | Glass |
| Protection glass | Hermetically sealed |
| EMC | Programmed code is not affected by natural electromagnetic interference or x-rays |
| Signal penetration | Transponder can be read through almost all nonmetallic material |
| Mechanical shock | IEC 60068-2-32 free-fall drop test, 20 times from 1.5-m height |
| Dimensions | Ø 2.12 ± 0.05 mm x 12.0 ± 0.5 mm |
| Weight | 0.10 g |
4 Device and Documentation Support
4.1 Documentation Support
The following documents describe the TRPGR30ATGC device. Copies of these documents are available on the Internet at www.ti.com.
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SPAT178RFID Systems Product Specifications. Texas Instruments Radio Frequency Identification Systems is an industry leader in RFID technology, and the world’s largest integrated manufacturer of TI-RFid™ tags, TI-RFid smart labels, and TI-RFid reader systems. With more than 1 billion RFID tags manufactured, TI-RFid technology is used in a broad range of RFID applications worldwide. TI is an active member of many standards bodies, including ISO, ISO/IEC, ECMA International, ETSI, and several national standardization bodies working to drive the adoption of global standards for RFID technology.
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SPAT18412mm Glass Encapsulated HDX Transponders. Product bulletin that provides an overview of the features of the glass encapsulated transponders from TI.
4.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
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TI E2E™ Online CommunityTI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
4.3 Trademarks
TI-RFid, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
4.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.5 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.
4.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
