SLLS810A July   2007  – July 2024 TRS208

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Electrical Characteristics, Driver
    7. 5.7 Electrical Characteristics, Receiver
    8. 5.8 Switching Characteristics, Driver
    9. 5.9 Switching Characteristics, Receiver
  7. 6 Parameter Measurement Information
  8. 7 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitor Selection
      2. 8.1.2 Electrostatic Discharge (ESD) Protection
      3. 8.1.3 ESD Test Conditions
      4. 8.1.4 Human-Body Model (HBM)
      5. 8.1.5 Machine Model (MM)
      6. 8.1.6 Typical Application
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)DB (SSOP)DW (SOIC)UNIT
24-Pins24-Pins
R θJAJunction-to-ambient thermal resistance 64.046°C/W
R θJBJunction-to-board thermal resistance 32.854.8°C/W
ψ JTJunction-to-top characterization parameter 3.07.5°C/W
ψ JBJunction-to-board characterization parameter 32.337.1°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance n/an/a°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.