SLLSFZ3 July   2024 TRS213E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Characteristics
    5. 5.5 Electrical Characteristics, Power and Status
    6. 5.6 Electrical Characteristics, Driver
    7. 5.7 Electrical Characteristics, Receiver
    8. 5.8 Switching Characteristics, Driver
    9. 5.9 Switching Characteristics, Receiver
  7. 6 Parameter Measurement Information
  8. 7 Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, non bus (logic/supply) pins(1) ±2000 V
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, RS-232 driver output/receiver input pins ±15000
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
IEC 61000-4-2, Contact Discharge, RS-232 driver output/receiver input pins(3) ±8000
IEC 61000-4-2, Air-Gap Discharge, RS-232 driver output/receiver input pins(4) ±15000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) For IEC ESD contact discharge test, 100 pF capacitor was connected to the DOUT3 pin to GND pin and recommended for given ESD performance.
(4) For IEC ESD Air-Gap discharge test, 50Ω series resistor was connected to SHDN and EN pins for hard bound conditions and recommended for given ESD performance when not driven by the microcontroller.