SLLSFZ3A July   2024  – January 2025

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Characteristics
    5. 5.5 Electrical Characteristics, Power and Status
    6. 5.6 Electrical Characteristics, Driver
    7. 5.7 Electrical Characteristics, Receiver
    8. 5.8 Switching Characteristics, Driver
    9. 5.9 Switching Characteristics, Receiver
  7. 6 Parameter Measurement Information
  8. 7 Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

5.8 Switching Characteristics, Driver

over recommended ranges of supply voltage and operating free-air temperature(unless otherwise noted)(1) 
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
Maximum data rate RL = 3 kΩ to 7 kΩ
One DOUT switching		 CL = 50pF to 1000 pF
See Figure 6-1		 250 kbps
tsk(p) Pulse skew(3) RL = 3 kΩ to 7 kΩ CL = 150 pF to 2500 pF
See Figure 6-2		 300 ns
tPLH(D) Propagation delay time, low to high level output RL = 3 kΩ CL = 2500 pF, all outputs loaded
See Figure 6-3		 2 us
tPHL(D) Propagation delay time, high to low level output RL = 3 kΩ CL = 2500 pF, all outputs loaded
See Figure 6-4		 2 us
SR(tr) Slew rate, transition region RL = 3 kΩ to 7 kΩ CL = 50pF to 1000 pF 3 6 30 V/us
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as|tPLH – tPHL| of each channel of the same device.