SLLSFZ3A July   2024  – January 2025

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Characteristics
    5. 5.5 Electrical Characteristics, Power and Status
    6. 5.6 Electrical Characteristics, Driver
    7. 5.7 Electrical Characteristics, Receiver
    8. 5.8 Switching Characteristics, Driver
    9. 5.9 Switching Characteristics, Receiver
  7. 6 Parameter Measurement Information
  8. 7 Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

5.9 Switching Characteristics, Receiver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
tPLH Propagation delay time, low- to high-level output CL = 150 pF 0.5 10 us
tPHL Propagation delay time, high- to low-level output 0.5 10 us
tsk(p) Pulse skew(3) CL = 150 pF, VCC = 5V, TA = 25°C 300 ns
ten Output enable time CL = 150 pF 600 ns
tdis Output disable time CL = 150 pF 200 ns
(1) Test conditions are C1–C4 = 0.1 µF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as|tPLH – tPHL| of each channel of the same device.