SLLSFZ3 July   2024 TRS213E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Characteristics
    5. 5.5 Electrical Characteristics, Power and Status
    6. 5.6 Electrical Characteristics, Driver
    7. 5.7 Electrical Characteristics, Receiver
    8. 5.8 Switching Characteristics, Driver
    9. 5.9 Switching Characteristics, Receiver
  7. 6 Parameter Measurement Information
  8. 7 Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Characteristics

THERMAL METRIC(1) DB (SSOP) UNIT
28 PINS
RΘJA Junction-to-ambient thermal resistance 66.1 ℃/W
RΘJC(top) Junction-to-case (top) thermal resistance 33.2 ℃/W
RΘJB Junction-to-board thermal resistance 37.0 ℃/W
ΨJT Junction-to-top characterization parameter 4.6 ℃/W
ΨJB Junction-to-board characterization parameter 36.5 ℃/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance - ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.