SLLS792C June   2007  – December 2024 TRS3221E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings, IEC Specifications
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Driver Section Electrical Characteristics
    8. 5.8  Driver Section Switching Characteristics
    9. 5.9  Receiver Section Electrical Characteristics
    10. 5.10 Receiver Section Switching Characteristics
    11. 5.11 Auto-Powerdown Section Electrical Characteristics
    12. 5.12 Auto-Powerdown Section Switching Characteristics
    13. 5.13 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power
      2. 7.3.2 RS232 Driver
      3. 7.3.3 RS232 Receiver
      4. 7.3.4 RS232 Status
    4. 7.4 Device Functional Modes
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Design Requirements
    4. 8.4 Detailed Design Procedure
    5. 8.5 Application Curve
    6.     Power Supply Recommendations
    7. 8.6 Layout
      1. 8.6.1 Layout Guidelines
      2. 8.6.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information

THERMAL METRIC(1)TRS3221EUNIT
DB (SSOP)PW (TSSOP)RGT (VQFN)DYY
(SOT-23-THN)
16 PINS16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance105.8110.952.1

120.0

°C/W
RθJC(top)Junction-to-case (top) thermal resistance51.941.760.6

56.8

°C/W
RθJBJunction-to-board thermal resistance57.657.226.8

51.3

°C/W
ψJTJunction-to-top characterization parameter14.14.22.5

2.6

°C/W
ψJBJunction-to-board characterization parameter56.856.626.8

50.9

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A12.0

N/A

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.