4 Revision History
Changes from Revision * (June 2007) to Revision A (August 2021)
- Updated the list of Applications
Go
- Deleted the Ordering Information tableGo
- Added the Device Information table, the Pin Configuration and
Functions, the Detailed Description section, the Application
and Implementation section. Removed RHL package from Device
Information table and Pin configuration and functions
tableGo
- Deleted the Package thermal impedance from the Absolute Maximum
Ratings
Go
- Added the ESD Ratings tableGo
- Added the ESD Ratings - IEC Specifications tableGo
- Added the Thermal
Information tableGo
- Changed the value of R θJA for PW package (previously in the Absolute
Maximum Ratings table), and added additional
thermal parameters for all packages in the
Thermal Information tableGo