SLLS790D June   2007  – June 2021 TRS3232E

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics — Device
    7. 6.7 Electrical Characteristics — Driver
    8. 6.8 Electrical Characteristics — Receiver
    9. 6.9 Switching Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
    4. 8.4 Device Functional Modes
      1. 8.4.1 VCC Powered by 3 V to 5.5 V
      2. 8.4.2 VCC Unpowered, VCC = 0 V
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 9-1)(1)
PARAMETERTEST CONDITIONSMINTYP(2)MAXUNIT
Maximum data rateRL = 3 kΩ,

CL = 1000 pF,
see Figure 7-1

One DOUT switching,
RGT package250500kbps
D, DB, DW and PW

packages

150250
tsk(p)Driver pulse skew(3)RL = 3 kΩ, CL = 1000 pF, VCC = 5 V Figure 7-2

RGT package

50ns
RL = 3 kΩ to 7 kΩ, CL = 150 pF to 2500 pF see Figure 7-2

D, DB, DW and PW packages

300
SR(tr)Driver slew rate, transition region
(see Figure 7-1)

RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
CL = 150 pF to 1000 pF630V/μs
CL = 150 pF to 2500 pF430
tPLHReceiver propagation delay time, low- to high-level outputCL = 150 pF,
see Figure 7-3
RGT package90ns
D, DB, DW and PW packages300
tPHLReceiver propagation delay time, high- to low-level outputCL = 150 pF,
see Figure 7-3

RGT package

100ns
D, DB, DW and PW packages300
tsk(p)Receiver pulse skew(3)

RGT package

20ns

D, DB, DW and PW packages

300
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.