SLLS790E June   2007  – December 2024 TRS3232E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics — Device
    7. 5.7 Electrical Characteristics — Driver
    8. 5.8 Electrical Characteristics — Receiver
    9. 5.9 Switching Characteristics
    10.     Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power
      2. 7.3.2 RS232 Driver
      3. 7.3.3 RS232 Receiver
    4. 7.4 Device Functional Modes
      1. 7.4.1 VCC Powered by 3V to 5.5V
      2. 7.4.2 VCC Unpowered, VCC = 0V
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information

THERMAL METRIC(1)TRS3232EUNIT
PW (TSSOP)D (SOIC)DW (SOIC)DB (SSOP)RGT (VQFN)DYY
(SOT-23-THN)
16 PINS16 PINS16 PINS16 PINS16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance108.285.972.3103.148.8

106.2

°C/W
RθJCtopJunction-to-case (top) thermal resistance39.043.133.549.255.8

47.4

°C/W
RθJBJunction-to-board thermal resistance54.444.537.154.823.2

44.7

°C/W
ψJTJunction-to-top characterization parameter3.310.17.512.01.7

1.7

°C/W
ψJBJunction-to-board characterization parameter53.844.137.154.123.2

43.7

°C/W
RθJCbotJunction-to-case (bottom) thermal resistanceN/AN/AN/AN/A9.0

N/A

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.