SLLS806C June   2007  – October 2022 TRS3243

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics—Power and Status
    6. 6.6  Electrical Characteristics—Driver
    7. 6.7  Electrical Characteristics—Receiver
    8. 6.8  Switching Characteristics—Power and Status
    9. 6.9  Switching Characteristics—Driver
    10. 6.10 Switching Characteristics—Receiver
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Automatic Power Down
      2. 8.3.2 Charge Pump
      3. 8.3.3 RS232 Driver
      4. 8.3.4 RS232 Receiver
      5. 8.3.5 ROUT2B Receiver
      6. 8.3.6 Invalid Input Detection
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Support Resources
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) {DB} (SSOP) {PW} (TSSOP) UNIT
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 76.1 70.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35.8 21.0 °C/W
RθJB Junction-to-board thermal resistance 37.4 29.2 °C/W
ψJT Junction-to-top characterization parameter 7.4 1.3 °C/W
ψJB Junction-to-board characterization parameter 37.0 28.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).