SLLS850D January   2008  – March 2017 TRS3253E

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics—Power
    6. 6.6  Electrical Characteristics—Driver
    7. 6.7  Electrical Characteristics—Receiver
    8. 6.8  Electrical Characteristics—Status
    9. 6.9  Switching Characteristics—Driver
    10. 6.10 Switching Characteristics—Receiver
    11. 6.11 Switching Characteristics—Power and Status
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power
      2. 8.3.2 RS232 Driver
      3. 8.3.3 RS232 Receiver
      4. 8.3.4 RS232 Status
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC to GND –0.3 6 V
VL to GND –0.3 VCC + 0.3
V+ to GND –0.3 7
V– to GND 0.3 –7
V+ + |V–|(2) 13
VI Input voltage DIN, FORCEOFF, and FORCEON to GND –0.3 6 V
RIN to GND ±25
VO Output voltage DOUT to GND ±13.2 V
ROUT to GND –0.3 VL + 0.3
Continuous power dissipation TA = 85°C, 32-pin RSM (RθJA = 37.2°C/W)(3) 1747 mW
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability..
(2) V+ and V– can have maximum magnitudes of 7 V, but their absolute difference cannot exceed 13 V.
(3) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA) / RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins except 17 to 23 and 25 ±2000 V
Pins 17 to 23 and 25 ±15000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) All pins ±1500
IEC61000-4-2, Contact discharge Pins 17 to 23 and 25 ±8000
IEC61000-4-2, Air-gap discharge Pins 17 to 23 and 25 ±15000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage 3 5.5 V
VL Supply voltage 1.65 VCC V
Input logic low DIN, FORCEOFF, FORCEON VL = 3 V or 5.5 V 0 0.8 V
VL = 2.3 V 0 0.6
VL = 1.65 V 0 0.5
Input logic high DIN, FORCEOFF, FORCEON VL = 5.5 V 2.4 VL V
VL = 3 V 2 VL
VL = 2.7 V 1.4 VL
VL = 1.95 V 1.25 VL
Operating temperature TRS3253EIRSMR –40 85 °C
Receiver input voltage –25 25 V

6.4 Thermal Information

THERMAL METRIC(1) TRS3253E UNIT
RSM (VQFN)
32 PINS
RθJA Junction-to-ambient thermal resistance 37.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 30.1 °C/W
RθJB Junction-to-board thermal resistance 7.8 °C/W
ψJT Junction-to-top characterization parameter 0.4 °C/W
ψJB Junction-to-board characterization parameter 7.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics—Power

over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 μF (tested at 3.3 V ± 10%), C1 = 0.047 μF, C2–C4 = 0.33 μF (tested at 5 V ± 10%) (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
II Input leakage current FORCEOFF, FORCEON ±0.01 ±1 μA
ICC Supply current
(TA = 25°C)		 Auto-powerdown plus disabled No load,
FORCEOFF and FORCEON at VCC 		0.5 1 mA
Powered off No load, FORCEOFF at GND 1 10 μA
Auto-powerdown plus active No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded		 1 10
(1) Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V. (See Figure 8)
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.

6.6 Electrical Characteristics—Driver

over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 μF (tested at 3.3 V ± 10%), C1 = 0.047 μF, C2–C4 = 0.33 μF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VOH Output voltage swing All driver outputs loaded with 3 kΩ to ground, VCC= 3.1V to 5.5V ±5 ±5.4 V
rO Output resistance VCC = V+ = V–  = 0, Driver output = ±2 V 300 10M Ω
IOS Output short-circuit current VT_OUT = 0 ±60 mA
IOZ Output leakage current VT_OUT = ±12 V, FORCEOFF = GND,
VCC = 3 V to 3.6 V		 ±25 μA
VT_OUT = ±12 V, FORCEOFF = GND,
VCC = 4.5 V to 5.5 V
Driver input hysteresis 0.5 V
Input leakage current DIN, FORCEOFF, FORCEON ±0.01 ±1 μA
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C

6.7 Electrical Characteristics—Receiver

over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 μF (tested at 3.3 V ± 10%), C1 = 0.047 μF, C2–C4 = 0.33 μF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Ioff Output leakage current ROUT, receivers disabled ±0.05 ±10 μA
VOL Output voltage low IOUT = 1.6 mA 0.4 V
VOH Output voltage high IOUT = –1 mA VL – 0.6 VL – 0.1 V
VIT– Input threshold low TA = 25°C VL = 5 V 0.8 1.2 V
VL = 3.3 V 0.6 1.5
VIT+ Input threshold high TA = 25°C VL = 5 V 1.8 2.4 V
VL = 3.3 V 1.5 2.4
Vhys Input hysteresis 0.5 V
Input resistance TA = 25°C 3 5 7 kΩ
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C

6.8 Electrical Characteristics—Status

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN MAX UNIT
VIT+(valid) Receiver input threshold
for INVALID high-level output voltage		 FORCEON = GND, FORCEOFF = VL 2.7 V
VIT–(valid) Receiver input threshold
for INVALID high-level output voltage		 FORCEON = GND, FORCEOFF = VL –2.7 V
VT(invalid) Receiver input threshold
for INVALID low-level output voltage		 FORCEON = GND, FORCEOFF = VL –0.3 0.3 V
VOH INVALID high-level output voltage IOH = –1 mA, FORCEON = GND,
FORCEOFF = VL 		VL – 0.6 V
VOL INVALID low-level output voltage IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VL 		0.4 V

6.9 Switching Characteristics—Driver

over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 μF (tested at 3.3 V ± 10%), C1 = 0.047 μF, C2–C4 = 0.33 μF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
Maximum data rate RL = 3 kΩ, CL = 200 pF, one driver switching 1000 kbps
Time-to-exit powerdown |VT_OUT| > 3.7 V 100 μs
|tPHL – tPLH| Driver skew(2) 100 ns
Transition-region
slew rate		 VCC = 3.3 V,
TA = 25°C,
RL = 3 kΩ to 7 kΩ,
Measured from 3 V
to –3 V or –3 V to 3 V 		CL = 150 pF to 1000 pF 15 150 V/μs
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C.
(2) Driver skew is measured at the driver zero crosspoint.

6.10 Switching Characteristics—Receiver

over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 μF (tested at 3.3 V ± 10%), C1 = 0.047 μF, C2–C4 = 0.33 μF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
tPHL Receiver propagation delay Receiver input to receiver output, CL = 150 pF 0.15 μs
tPLH 0.15
tPHL – tPLH Receiver skew 50 ns
ten Receiver output enable time From FORCEOFF 200
tdis Receiver output disable time From FORCEOFF 200
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C.

6.11 Switching Characteristics—Power and Status

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 7)
PARAMETER MIN TYP(1) MAX UNIT
tvalid Propagation delay time, low- to high-level output 0.1 μs
tinvalid Propagation delay time, high- to low-level output 50
ten Supply enable time 25
tdis Receiver or driver edge to auto-powerdown plus 15 30 60 s
(1) All typical values are at VCC = VL = 3.3 V and TA = 25°C.

6.12 Typical Characteristics

VCC = 3.3 V
TRS3253E C001_VOH.png
Figure 1. DOUT VOH vs Load Current
Other Drivers 3-kΩ Load
TRS3253E C001_VOL.png
Figure 2. DOUT VOL vs Load Current
Other Drivers 3-kΩ Load