SLLS823A July   2007  – August 2021 TRSF3222E

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics: Driver
    8. 6.8  Switching Characteristics: Driver
    9. 6.9  Electrical Characteristics: Receiver
    10. 6.10 Switching Characteristics: Receiver
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information

THERMAL METRIC(1)TRSF3222EUNIT
DB (SSOP)DW (SOIC)PW (TSSOP)
20 Pins20 Pins20 Pins
R θJAJunction-to-ambient thermal resistance7058

94.1

°C/W
R θJBJunction-to-board thermal resistance

33.6

30.0

35.2

°C/W
ψ JTJunction-to-top characterization parameter

36.4

29.6

45.5

°C/W
ψ JBJunction-to-board characterization parameter

4.8

7.7

3.1

°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance

35.9

29.3

45.1

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.