SLLS824B August   2007  – December 2023 TRSF3223E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Recommended Operating Conditions
    3. 4.3  ESD Ratings
    4. 4.4  ESD Ratings - IEC Specifications
    5. 4.5  Thermal Information
    6. 4.6  Electrical Characteristics
    7. 4.7  Electrical Characteristics, Driver
    8. 4.8  Switching Characteristics, Driver
    9. 4.9  Electrical Characteristics, Receiver
    10. 4.10 Switching Characteristics, Receiver
    11. 4.11 Electrical Characteristics, Auto-Powerdown
    12. 4.12 Switching Characteristics, Auto-Powerdown
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Detailed Design Procedure
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.