SLLS824B August   2007  – December 2023 TRSF3223E

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Recommended Operating Conditions
    3. 4.3  ESD Ratings
    4. 4.4  ESD Ratings - IEC Specifications
    5. 4.5  Thermal Information
    6. 4.6  Electrical Characteristics
    7. 4.7  Electrical Characteristics, Driver
    8. 4.8  Switching Characteristics, Driver
    9. 4.9  Electrical Characteristics, Receiver
    10. 4.10 Switching Characteristics, Receiver
    11. 4.11 Electrical Characteristics, Auto-Powerdown
    12. 4.12 Switching Characteristics, Auto-Powerdown
  6. Parameter Measurement Information
  7. Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Detailed Design Procedure
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Recommended Operating Conditions

See Figure 7-1 and (1)
MINNOMMAXUNIT
Supply voltageVCC = 3.3 V33.33.6V
VCC = 5 V4.555.5
VIHDriver and control
high-level input voltage
DIN, EN, FORCEOFF, FORCEONVCC = 3.3 V2V
VCC = 5 V2.4
VILDriver and control
low-level input voltage
DIN, EN, FORCEOFF, FORCEON0.8V
VIDriver and control input voltageDIN, EN, FORCEOFF, FORCEON05.5V
Receiver input voltage–2525
TAOperating free-air temperatureTRSF3223EC070°C
TRSF3223EI–4085
Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.