SLLS824B August   2007  – December 2023 TRSF3223E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Recommended Operating Conditions
    3. 4.3  ESD Ratings
    4. 4.4  ESD Ratings - IEC Specifications
    5. 4.5  Thermal Information
    6. 4.6  Electrical Characteristics
    7. 4.7  Electrical Characteristics, Driver
    8. 4.8  Switching Characteristics, Driver
    9. 4.9  Electrical Characteristics, Receiver
    10. 4.10 Switching Characteristics, Receiver
    11. 4.11 Electrical Characteristics, Auto-Powerdown
    12. 4.12 Switching Characteristics, Auto-Powerdown
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 Detailed Design Procedure
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.3 ESD Ratings

VALUEUNIT
V (ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

All pins except RIN1, RIN2, DOUT1 and DOUT2 pins

±3000V

RIN1, RIN2, DOUT1 and DOUT2 pins to GND

±15000
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)

All pins

±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.