SCDS248E October   2009  – September 2022 TS12A12511

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: ±5-V Dual Supply
    6. 6.6 Electrical Characteristics: 12-V Single Supply
    7. 6.7 Electrical Characteristics: 5-V Single Supply
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (January 2019) to Revision E (September 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the Applications sectionGo
  • Updated the Leakage Current vs I/O Voltage (Switch ON) and Leakage Current vs I/O Voltage (Switch OFF) figuresGo

Changes from Revision C (January 2015) to Revision D (January 2019)

  • Added Junction temperature to the Absolute Maximum Ratings tableGo

Changes from Revision B (April 2011) to Revision C (January 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from Revision A (May 2010) to Revision B (April 2011)

  • Deleted preview status from DGK and DCN packages.Go