SCDS248E October   2009  – September 2022 TS12A12511

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: ±5-V Dual Supply
    6. 6.6 Electrical Characteristics: 12-V Single Supply
    7. 6.7 Electrical Characteristics: 5-V Single Supply
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TS12A12511UNIT
DCNDGKDRJ
8 PINS
RθJAJunction-to-ambient thermal resistance218.4184.547.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance89.971.048.6
RθJBJunction-to-board thermal resistance144.4104.524.2
ψJTJunction-to-top characterization parameter7.811.31.2
ψJBJunction-to-board characterization parameter141.7103.324.4
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A9.0
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.