SLOS489D December   2005  – May 2018 TS321

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: TS321
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Gain Bandwidth Product
      3. 7.3.3 Slew Rate
      4. 7.3.4 Input Common-Mode Range
      5. 7.3.5 Stability With High Capacitive Loads
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Typical Characteristics

TS321 IIB.png
Figure 1. Input Current vs Temperature
TS321 IOL.png
Figure 3. Output Sinking Characteristics
TS321 IOS_Low.png
Figure 5. Short-Circuit Current to Supply (1)
TS321 ICC.png
Figure 2. Supply Current vs Temperature
TS321 VOH_LOSS.png
Figure 4. Output Sourcing Characteristics
TS321 IOS_High.png
Figure 6. Short-Circuit Current to Ground
1. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.