SCDS358B November   2014  – February 2015 TS3A227E

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Characteristics
    7. 7.7 Timing Diagrams
      1. 7.7.1 Removal
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Accessory Configuration Detection
      2. 9.3.2 Optional Manual I2C Control
      3. 9.3.3 Adjustable De-bounce Timings
      4. 9.3.4 Key Press Detection
      5. 9.3.5 Click Pop Noise Reduction
      6. 9.3.6 Power off Noise Removal
      7. 9.3.7 Sleep Mode
      8. 9.3.8 Codec Sense Line
      9. 9.3.9 FM Support
    4. 9.4 Device Functional Modes
      1. 9.4.1 Sleep Mode
      2. 9.4.2 Manual Switch Control
      3. 9.4.3 Manual Switch Control Use Cases
      4. 9.4.4 FM Support Mode
    5. 9.5 Register Maps
    6. 9.6 Register Field Descriptions
      1. 9.6.1  Device ID Register Field Descriptions (Address 00h)
      2. 9.6.2  Interrupt Register Field Descriptions (Address 01h)
      3. 9.6.3  Key Press Interrupt Register Field Descriptions (Address 02h)
      4. 9.6.4  Interrupt Disable Register Field Descriptions (Address 03h)
      5. 9.6.5  Device Settings Field Descriptions (Address 04h)
      6. 9.6.6  Key Press Settings 1 Field Descriptions (Address 05h)
      7. 9.6.7  Key Press Settings 2 Field Descriptions (Address 06h)
      8. 9.6.8  Switch Control 1 Field Descriptions (Address 07h)
      9. 9.6.9  Switch Control 2 Field Descriptions (Address 08h)
      10. 9.6.10 Switch Status 1 Field Descriptions (Address 09h)
      11. 9.6.11 Switch Status 2 Field Descriptions (Address 0Ah)
      12. 9.6.12 Detection Results Field Descriptions (Address 0Bh)
      13. 9.6.13 ADC Output Field Descriptions (Address 0Ch)
      14. 9.6.14 Threshold 1 Field Descriptions (Address 0Dh)
      15. 9.6.15 Threshold 2 Field Descriptions (Address 0Eh)
      16. 9.6.16 Threshold 3 Field Descriptions (Address 0Fh)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Standard I2C Interface Details
        2. 10.2.1.2 Write Operations
        3. 10.2.1.3 Read Operations
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Accessory Insertion
        2. 10.2.2.2 Audio Jack Selection
        3. 10.2.2.3 Switch Status
          1. 10.2.2.3.1 Switch Status Diagrams
        4. 10.2.2.4 Key Press Detection
          1. 10.2.2.4.1 Key Press Thresholds
          2. 10.2.2.4.2 System Requirements
          3. 10.2.2.4.3 Key Press Grey Zones
          4. 10.2.2.4.4 Behavior
          5. 10.2.2.4.5 Single Key Press Timing
          6. 10.2.2.4.6 Multiple Key Press Timing
          7. 10.2.2.4.7 Raw Data Key Press Detection
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example (QFN)
    3. 12.3 Layout Example (DSBGA)
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

DSBGA – YFF
Top View
po_DSBGA_YFF_scds358.gif
QFN – RVA
Top View
po_QFN_RVA_scds358.gif

Pin Functions

PIN TYPE DESCRIPTION
NAME RVA YFF
DET_TRIGGER 15 B1 I/O A falling edge from high to low on this pin triggers accessory detection. This pin can be connected the headset jack to allow automatic pull-down to ground after headset insertion to initialize detection.
GND 1, 2 A2, B2 GND Primary ground connection for the TS3A227E. Must be connected to system ground.
GNDA 11 D2 I/O Ground connection for the internal ground FETs of the TS3A227E. If FM is being supported connect this pin to the FM matching network. If FM is not being support connect this pin to system ground.
GND_SENSE 5 A4 I/O Ground sense line for the codec.
INT 13 C2 GND Open drain interrupt output from the TS3A227E to notify the host that an event has occurred. If I2C is not used this pin must be grounded.
MIC_PRESENT 16 A1 I/O Open drain output to indicate to the host that a headset with a microphone is inserted..
MICP 6 B4 I/O Microphone signal connection to the codec. Microphone bias is applied to this pin.
RING2 12 D1 O Headset current return path if RING2 is ground for the headset. Connect to 3.5 mm jack RING2 connection with low DC resistance trace.
RING2_SENSE 7 C4 GND Connected to the RING2 pin of the 3.5 mm jack. If RING2 pin on plug in is MIC signal, this is connected to MICP. If not, this is connected to GND_SENSE and becomes the ground sensing feedback for the accessory
SCL 9 C3 I Clock from I2C bus. This can be connected to VDD if I2C is not used.
SDA 3 B3 I/O Bidirectional data from/to I2C bus. This can be connected to VDD if I2C is not used.
SLEEVE 10 D3 O Headset current return path if SLEEVE is GND for headset. Connect to 3.5 mm jack SLEEVE connection with low DC resistance trace.
SLEEVE_SENSE 8 D4 GND Connected to the SLEEVE pin of the 3.5 mm jack. If SLEEVE pin on plug in is MIC signal, this is connected to MICP. If not, this is connected to GND_SENSE and becomes the ground sensing feedback for the accessory
THERMAL PAD GND The THERMAL PAD of the RVA – QFN package must be connected to any internal PCB ground plane using multiple vias for best thermal performance.
TIP 14 C1 I/O Connect to the TIP pin of the 3.5 mm jack.
VDD 4 A3 PWR Power input to the TS3A227E. External de-coupling capacitors are required on this pin.