SCDS387
October 2018
TS3A5017-Q1
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Block Diagram
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics for 3.3-VSupply
6.6
Electrical Characteristics for 2.5-VSupply
6.7
Switching Characteristics for 3.3-VSupply
6.8
Switching Characteristics for 2.5-VSupply
6.9
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Device Support
12.1.1
Device Nomenclature
12.2
Documentation Support
12.2.1
Related Documentation
12.3
Receiving Notification of Documentation Updates
12.4
Community Resources
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGY|16
MPQF115G
Thermal pad, mechanical data (Package|Pins)
Orderable Information
scds387_oa
scds387_pm
6.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±1500
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.