SCDS188G January 2005 – January 2019 TS3A5017
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics for 3.3-V Supply
- 6.6 Electrical Characteristics for 2.5-V Supply
- 6.7 Switching Characteristics for 3.3-V supply
- 6.8 Switching Characteristics for 2.5-V supply
- 6.9 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
Package Options
Refer to the PDF data sheet for device specific package drawings
Mechanical Data (Package|Pins)
- PW|16
- DBQ|16
- RGY|16
- D|16
- DGV|16
- RSV|16
Thermal pad, mechanical data (Package|Pins)
- RGY|16
Orderable Information
6.9 Typical Characteristics
Figure 1. ron vs VCOM 
Figure 3. ron vs VCOM (V+ = 2.5 V) 
Figure 5. Charge Injection (QC) vs VCOM 
Figure 7. Logic-Level Threshold vs V+ 
Figure 9. OFF Isolation and Crosstalk vs Frequency
(V+ = 3.3 V)
Figure 11. Power-Supply Current vs Temperature
(V+ = 3.6 V)
Figure 2. ron vs VCOM (V+ = 3.3 V) 
Figure 4. Leakage Current vs Temperature (V+ = 3.6 V) 
Figure 6. tON and tOFF vs Supply Voltage 
Figure 8. Bandwidth (Gain vs Frequency) (V+ = 3.3 V) 
Figure 10. Total Harmonic Distortion vs Frequency