SCDS189H January   2005  – May 2018 TS3A5018

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics for 3.3-V Supply
    6. 6.6  Electrical Characteristics for 2.5-V Supply
    7. 6.7  Electrical Characteristics for 2.1-V Supply
    8. 6.8  Electrical Characteristics for 1.8-V Supply
    9. 6.9  Switching Characteristics for 3.3-V Supply
    10. 6.10 Switching Characteristics for 2.5-V Supply
    11. 6.11 Switching Characteristics for 1.8-V Supply
    12. 6.12 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram (Each Switch)
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • DBQ|16
  • RGY|16
  • D|16
  • DGV|16
  • RSV|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

TS3A5018 typ1_cds189.gif
Figure 1. ron vs VCOM (V+ = 3.3 V)
TS3A5018 typ4_cds189.gif
Figure 3. Leakage Current vs Temperature (V+ = 3.6 V)
TS3A5018 typ5_cds189.gif
Figure 5. Charge Injection (QC) vs VCOM
TS3A5018 typ6_cds189.gif
Figure 7. tON and tOFF vs Supply Voltage
TS3A5018 G001_SCDS189.gif
Figure 9. Logic-Level Threshold vs V+
TS3A5018 gain_iso_cds189.gif
Figure 11. OFF Isolation vs Frequency (V+ = 1.8 V)
TS3A5018 gain_xtalk_cds189.gif
Figure 13. Crosstalk vs Frequency (V+ = 1.8 V)
TS3A5018 typ11_cds189.gif
Figure 15. Total Harmonic Distortion vs Frequency
TS3A5018 typ2_cds189.gif
Figure 2. ron vs VCOM (V+ = 2.5 V)
TS3A5018 G005_SCDS189.gif
Figure 4. Leakage Current vs Temperature (V+ = 1.8 V)
TS3A5018 chging_vcom_cds189.gif
Figure 6. Charge Injection (QC) vs VCOM (V+ = 1.8 V)
TS3A5018 typ7_cds189.gif
Figure 8. tON and tOFF vs Temperature (V+ = 3.3 V)
TS3A5018 typ9_cds189.gif
Figure 10. Gain vs Frequency Bandwidth (V+ = 3.3 V)
TS3A5018 gain_adj_cds189.gif
Figure 12. Crosstalk Adjacent vs Frequency (V+ = 1.8 V)
TS3A5018 typ10_cds189.gif
Figure 14. OFF Isolation vs Frequency
(V+ = 3.3 V)
TS3A5018 typ12_cds189.gif
Figure 16. Power-Supply Current vs Temperature
(V+ = 3.3 V)